According to the information from Tianyancha, the industrial and commercial information of the semiconductor start-up company Jiangsu Xinde Semiconductor Technology Co., Ltd. (hereinafter referred to as “Xinde Semiconductor”) changed on August 27, adding Hubei Xiaomi Changjiang Industrial Fund Partnership (Limited Partnership), Nanjing Municipal Talent Innovation and Venture Capital Fund Partnership (Limited Partnership) are shareholders, and the registered capital has increased from 610 million yuan to 700 million yuan, an increase of 14.75%.

  With a planned total investment of 6 billion yuan, this semiconductor start-up company has been invested by Xiaomi

△ Source: Screenshot of Tianyancha

Official information shows that Xinde Semiconductor was established in September 2020 as a newly established semiconductor company with a total investment plan of 6 billion yuan. It has first-class packaging design capabilities for mid-to-high-end products and the world’s leading R&D and production of high-end packaging and testing technologies such as Bumping, WLCSP, Flip Chip PKG, QFN, BGA, SiP, etc. One-stop high-end mid- and back-end semiconductor packaging and testing services.

On April 21 this year, the completion and commissioning ceremony of the first phase of Xinde Semiconductor’s high-end packaging project was held in Nanjing Pukou Economic Development Zone.

According to the information of Pukou Economic Development Zone, the total investment of the packaging base project of Jiangsu Xinde Semiconductor Technology Co., Ltd. is 950 million yuan, of which the first phase of the project covers an area of ​​about 60,000 square meters. Around 1000 people are employed. The output value scale of the project will reach 300 million yuan in 2021, and the output value scale in 2022 will enter the sequence of 1 billion yuan. It is planned to enter the listing stage within three years and reach an output value scale of 5 billion yuan within five years.

The WeChat account “Pukou Release” pointed out that the project will start in October 2020 and be completed in April 2021. It is estimated that about 20 billion semiconductor chips will be packaged and tested annually, and the annual output of advanced bump technology will be about 3.5 million pieces.


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