【Introduction】Atomic layer deposition (ALD) process is considered to be an important driving force for the miniaturization of logic and memory semiconductor devices. Over the past 20 years, ALD processes and equipment have been widely used in the high-volume manufacturing of logic and memory devices, driving devices such as dynamic random access memory (DRAM), advanced fin field effect transistors (FinFET), and gate-surround transistors. Performance improvements and innovations. As Moore’s Law slows, the ALD process gradually penetrates into more applications, such as the production of More-than-Moore (MtM) devices, driving new architectures, materials, and performance improvements.

According to a report by research firm Yole Développement, global fab capacity expansion initiatives are driving a surge in ALD equipment sales. It is expected that the market size of ALD equipment in ultra-molecular applications will continue to grow in the next few years, with a compound annual growth rate of 12% from 2020 to 2026, and is expected to reach US$680 million in 2026.

SRII Introduces Two New ALD Products Addressing the Need for Versatility and Flexibility in Pan-Semiconductor Applications

Market Forecast by Yole Développement for ALD Equipment

Keeping up with the market demand in 2022, SRII launched two blockbuster new products to expand the application layout

Committed to meeting the growing technical demands in the field of semiconductor manufacturing, the industry-leading ALD equipment manufacturer and service provider – Qingdao Sifang Sirui Intelligent Technology Co., Ltd. (hereinafter referred to as Sirui Intelligence or SRII), the Beneq brand has a new design and a heavy launch. Two new products for semiconductor device manufacturing: Prodigy and Transform300.

Patrick Rabinzohn, head of SRII’s Beneq brand semiconductor business, said: “Going into 2022, more diverse and complex emerging semiconductor applications are emerging, and Prodigy is designed for compound semiconductor manufacturing, including radio frequency integrated circuits (GaAs / GaN / InP ), LEDs, VCSELs, photodetectors and other MEMS manufacturers and foundries in related fields will benefit from the new Prodigy series to achieve market-competitive ALD batch processing capabilities with high cost performance, and effectively improve device performance and reliability. Transform300 continues to expand on the original advantageous Transform series, and is further suitable for the ALD coating requirements of 300mm wafer products. It has excellent versatility and versatility. It is also FAB-READY and can be easily integrated into customers’ production lines. .”

SRII Introduces Two New ALD Products Addressing the Need for Versatility and Flexibility in Pan-Semiconductor Applications

Prodigy provides market-competitive ALD solutions for compound semiconductors and MEMS devices

SRII Introduces Two New ALD Products Addressing the Need for Versatility and Flexibility in Pan-Semiconductor Applications

New Transform300 Products Further Match Emerging Semiconductor Applications

Prodigy sets a new benchmark for ALD mass production technology for compound semiconductors and MEMS devices, addressing numerous market segments supported by high-end ALD technology, providing optimal passivation and thin film deposition for 8” and below wafers and a variety of materials The ideal mass production solution. Prodigy not only integrates the latest ALD technology of SRII, but also has high cost performance, easy to realize batch processing technology to improve the performance of target products, suitable for 75-200mm wafer products.

It is worth mentioning that Transform300 is currently the only 300mm ALD cluster tool on the market that combines plasma enhanced and thermal ALD ordered processes. So far, the Transform series can provide IDMs and foundries with a process platform that integrates monolithic, batch, plasma-enhanced and thermal methods, and is designed to meet the needs of very large-scale integration (VLSI) manufacturing such as logic and storage, CMOS imaging Sensors, power devices, Micro-OLED/LED, advanced packaging and more ultra-molecular application scenarios.

Transform ALD coating equipment introduction video link:

Strengthen in-depth industrial cooperation and empower vertical industry innovation with advanced technology

With the advent of the Internet of Everything era, the importance of a wide range of sensor products has become increasingly prominent. Taking CMOS sensor (CIS), a typical ultra-molecular application as an example, with the improvement of chip integration, the structure of CIS chips is also constantly innovating. For example, image sensors, memory and more logic components are packaged in a unified manner . In order to achieve better photosensitivity, a surface passivation layer is often required to reduce the loss of photons, or an anti-reflection coating allows more photons to reach the receiver. In such a deep trench coating scenario, ALD can achieve 100% coverage, or use different coating materials, different coating layers, etc. to form different refractive indices and different laminate film ratios, so as to better meet customer differences. ization needs.

Patrick Rabinzohn said: “ALD is very good at thin films with high quality, high conformality and uniformity, and it has become the mainstream of CIS applications. At the same time, in order to face more ultra-molecular applications, ALD processes are also being used globally. Continuous development and improvement. SRII is an active participant in this global cooperation and is continuing to work closely with upstream and downstream institutions/manufacturers such as academia, research institutions, material suppliers, equipment sub-components and tool suppliers, and metrology system suppliers. , to achieve mutual benefit and innovative development, so as to ensure the leading position of its own ALD process.”

At present, in the Chinese market, SRII has established strategic cooperative relations with the National Smart Sensor Innovation Center and major scientific research institutions, focusing on joint research and development in important fields such as CIS and MEMS, and is committed to accelerating the industrial landing in the ultra-molecular field.

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