In 2020, in addition to the 7nm graphics card, AMD’s four product lines of desktop Ryzen, HEDT fever processor, server Xiaolong and notebook Ryzen APU will continue to be upgraded. 3 models will be 7nm+EUV process and Zen3 architecture. AMD’s continued increase in the 7nm process will make them surpass Apple, HiSilicon, and Qualcomm for the first time in TSMC’s 7nm production capacity.

According to reports, TSMC’s 7nm production capacity in the first half of 2020 will increase to 110,000 wafers per month, of which Apple, Huawei HiSilicon, Qualcomm, AMD and MediaTek are the 1-5 largest customers, and the top four account for about 20%. MediaTek accounted for about 13%.

In the second half of the year, TSMC will continue to increase the 7nm production capacity to 140,000 wafers per month, but Apple and HiSilicon will switch to the 5nm process, which will increase the proportion of AMD’s 7nm orders, which is expected to cover 30,000 wafers per month. Production capacity, the proportion has increased to 21%, surpassing Apple to become TSMC’s largest customer of 7nm, while the share of HiSilicon and Qualcomm is only 17-18%, and MediaTek has increased to 14%.

Although AMD surpassed Apple and HiSilicon to become TSMC’s largest 7nm customer, the main reason is that the two companies’ A14 and Kirin 1020 processors will switch to the 5nm process this year, but from the results, AMD occupies such a large share of TSMC’s production capacity. The ratio is the first, underscoring the importance of cooperation between the two parties.

Author: Xian Rui

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